Qualcomm confirms that the LeTV Le Max Pro will be first phone announced with the Snapdragon 820 SoC

Qualcomm CEO Steven Mollenkopf confirmed today a story that we told you Monday, namely that the LeTV Le Max Pro will be the first phone unveiled with the Snapdragon 820 chipset under the hood. The executive said that the LeTV phone will be the first of 80 products that have been designed to run on Qualcomm's latest and greatest SoC. The chip contains a quad-core CPU made up of Qualcomm's home-grown Kryo cores, and the Adreno 530 GPU.

The LeTV Le Max Pro will have a feature allowing it to share data between devices, according to Mollenkopf. The phone will also be the first to employ Qualcomm's ultrasonic fingerprint scanner, which doesn't require the use of buttons or sensors. As a result, the fingerprint reader can be embedded in a phone's screen. The Le Max Pro, however, will have the scanner placed on the back.

LeTV's beast will also support Wi-Fi 802.11ad. Not only will this provide for faster speeds while using a Wi-Fi network, it also supports the use of a wireless docking system. Think Microsoft's Continuum without wires. Users will be able to wirelessly connect the phone to a mouse and physical QWERTY keyboard.

Since the announcement was made at a Qualcomm press event, there was no word on pricing or availability for the LeTV Le Max Pro.


source: VentureBeat, SlashGear

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